UV Adhesives | Encapsulant
Microelectronics need protection? UV curable encapsulants offer rapid curing & robust defense against moisture & stress. Learn more.
Microelectronics are the building blocks of modern technology, powering everything from smartphones to medical devices. Protecting these delicate components during assembly and throughout their lifespan is crucial for ensuring device reliability. This blog explores UV light curable encapsulants, a revolutionary solution for microelectronic assembly and integrated circuit (IC) protection.
What are UV Light Curable Encapsulants?
UV light curable encapsulants are specialized liquid materials that solidify upon exposure to ultraviolet (UV) light. Here’s what makes them ideal for microelectronics:
- Fast Curing: Exposure to UV light triggers rapid polymerization, creating a protective layer around the microelectronic components within seconds or minutes. This expedites assembly processes compared to traditional methods.
- Conformal Coating: The liquid form fills even the most intricate gaps and contours on the microelectronic components, providing a seamless and complete encapsulation.
- Excellent Protection: Cured encapsulants offer superior protection against moisture, contamination, mechanical stress, and environmental factors that can damage delicate electronic components.
- Transparent and Low Outgassing: Encapsulants are typically clear, allowing for easy visual inspection of components. They also exhibit minimal emission of volatile organic compounds (VOCs) during curing, minimizing potential harm to components.
- Variety of Formulations: Available in various viscosities and with different properties to cater to specific needs, such as thermal conductivity or flame retardancy.
Benefits of UV Light Curable Encapsulants for Microelectronics
UV light curable encapsulants offer significant advantages over traditional encapsulation methods:
- Increased Throughput: Fast curing times significantly reduce assembly times compared to heat-cured epoxies, boosting production efficiency.
- Improved Quality Control: Rapid curing minimizes the risk of component damage from prolonged exposure to heat.
- Enhanced Reliability: Superior protection against environmental factors leads to more reliable and longer-lasting microelectronic devices.
- Simplified Processing: One-part formulations eliminate the need for complex mixing procedures, simplifying application.
- Environmentally Friendly: UV curing reduces energy consumption compared to heat-curing methods. Certain formulations offer low VOC emissions.
Incure Encap™ Series Core Products
Product
Description
Substrates
Color
Viscosity (cP)
Tensile Strength (psi)
Hardness (Shore D)
Elongation (%)
Encap™ 3522
Low viscosity encapsulant providing a clear, hard, sleek, and resilient protective coating (300-4,500 microns). Very low water absorption for reliable performance in Singapore’s humid climate.
Low Adhesion
Clear
20
150
84 – 94
4
Encap™ 3555
Ultra-low stress, clear electronic component encapsulant with fast curing and good light transmission. Enhanced moisture and temperature resistance. Gentle on flexible circuits.
Multi-Substrates (Low Adhesion)
Clear
20
4,150
63 – 73
32
Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle /
250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail
Applications for UV Light Curable Encapsulants
The versatility and protective properties of UV light curable encapsulants make them ideal for various microelectronic assembly and IC protection applications:
- Chip-on-Board (COB) Assembly: Encapsulate delicate electronic components directly onto printed circuit boards (PCBs).
- Ball Grid Array (BGA) Encapsulation: Protect BGA packages used in high-density electronic devices.
- Underfill Applications: Fill microscopic gaps between ICs and PCBs to improve thermal performance and prevent electrical shorts.
- Sensor Protection: Encapsulate sensitive sensors used in various devices for enhanced environmental protection.
- IC Protection in Harsh Environments: Provide robust protection for ICs used in demanding environments like automotive or industrial applications.
Choosing the Right UV Light Curable Encapsulant
Selecting the optimal UV light curable encapsulant requires considering several factors:
- Substrate Compatibility: Ensure the encapsulant adheres well to the specific materials used in the microelectronic assembly.
- Desired Properties: Consider factors like viscosity, thermal conductivity, flame retardancy, and moisture resistance based on the application needs.
- Curing Speed: Choose a curing speed that aligns with your production line throughput for optimal efficiency.
- Light Source Compatibility: Ensure the encapsulant is compatible with the wavelength of your UV curing lamp.
Embrace Efficiency and Protection with UV Light Curable Encapsulants
UV light curable encapsulants offer a powerful and efficient solution for microelectronic assembly and IC protection. Their fast curing speeds, conformal coating capabilities, and superior protection properties make them a compelling choice for manufacturers of innovative electronic devices. So, if you’re looking to streamline your assembly process, enhance device reliability, and ensure superior protection for your microelectronics, consider incorporating UV light curable encapsulants and empower your technology to thrive.